By:Sharif Sakr
There has been talk about 3D memory chips for years. At IDF, Intel has recently unveiled their Hybrid Memory Cube. This cube promises 7x(times) the energy effiency than the DDR3. IBM and Micron now have a partnership to make these cubes. To make the cube, they will use layers of DRAM that are connected by vertical conduits(TSVs). These pillers make the cube have a 70% cut in its hunger for energy, a 90% reduction in the chip's physical footprint, and this makes the cube have an increase in bandwidth. The HMC prototypes have a 128G/s. Now that makes a 6Gb look like a thiny bug! So this 3D cube can be a game changer, but it might have some compitition...